Understanding the three phases of a FAB fitout and how to integrate them is integral to successful design and construction of semiconductor manufacturing facilities

Why build something in the air when it can be built safer on the ground? Why install equipment that might create a safety risk to maintenance workers during future repair or replacement? These are key considerations that cut to the core of Prevention Through Design (PtD).

Our semiconductor/microelectronics clients are in a highly competitive industry and rely on delivering technology at a faster pace to gain market advantage.